JPH0414942Y2 - - Google Patents

Info

Publication number
JPH0414942Y2
JPH0414942Y2 JP1985012626U JP1262685U JPH0414942Y2 JP H0414942 Y2 JPH0414942 Y2 JP H0414942Y2 JP 1985012626 U JP1985012626 U JP 1985012626U JP 1262685 U JP1262685 U JP 1262685U JP H0414942 Y2 JPH0414942 Y2 JP H0414942Y2
Authority
JP
Japan
Prior art keywords
light emitting
light
emitting diode
lens
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985012626U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61129357U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985012626U priority Critical patent/JPH0414942Y2/ja
Publication of JPS61129357U publication Critical patent/JPS61129357U/ja
Application granted granted Critical
Publication of JPH0414942Y2 publication Critical patent/JPH0414942Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1985012626U 1985-01-31 1985-01-31 Expired JPH0414942Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985012626U JPH0414942Y2 (en]) 1985-01-31 1985-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985012626U JPH0414942Y2 (en]) 1985-01-31 1985-01-31

Publications (2)

Publication Number Publication Date
JPS61129357U JPS61129357U (en]) 1986-08-13
JPH0414942Y2 true JPH0414942Y2 (en]) 1992-04-03

Family

ID=30495868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985012626U Expired JPH0414942Y2 (en]) 1985-01-31 1985-01-31

Country Status (1)

Country Link
JP (1) JPH0414942Y2 (en])

Also Published As

Publication number Publication date
JPS61129357U (en]) 1986-08-13

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